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Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP Colour: Green/White/Black

SKU 60945944519
4.7
USD109.35 USD157.35

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Ships within 48 hours · Estimated delivery Sep 9 - Sep 14

Description

Colour: Green/White/Black

Ptl-83-499-Yl

Protective sleeve cover with pocket clip

Remove Flux residues from printed circuit boards

IEC 61326-1

Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP Colour: Green/White/BlackOverview Solder Paste in jar 250g (T3) SAC305 no clean 88. 5% metal. Specifications Alloy Sn96. 5 Ag3. 0 Cu0. 5 Flux Type Synthetic No Clean Flux Classification REL0 Metal Content 88. 5% metal by weight Particle Size T3 (25 45 microns) Melting Point 217 220C (423 428F) Size 250g Jar Stencil Life >8 hours @ 20 50% RH 22 28C (72 82F) >4 hours @ 50 70% RH 22 28C (72 82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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